Power solutions head for APEC 2017 in Tampa

8th March 2017

Mick Elliott

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At APEC 2017 in Tampa, Florida (March 27-29), Richardson RFPD will highlight a wide range of innovative technologies from the world's leading suppliers of applied power electronics solutions. Featured on the company stand will be ADI drivers for wide bandgap technologies, featuring low propagation delay and cost/size reductions versus opto-coupler solutions, and Astrodyne EMI filters (single-phase, 3-phase, DC, COTs and custom designs) for virtually any industry.

The array of technologies on show continues with Cornell Dubilier’s new Slimpack aluminum electrolytic capacitors for mission critical applications, replace 3+ axial wet tantalum capacitors in parallel and GaN Systems’ new totem pole PFC reference design that integrates GaN power transistors for 5x power loss improvement and increased efficiency from 96% to 99%

Also on parade will be Maxwell ultracapacitor cells and modules for peak power and energy storage, and Microsemi’s new 650V Trench 5 IGBT modules with lower switching and conduction losses are best-in-class for hard switching frequencies from 30-100kHz.

Peregrine Seiconductor demos at the Richardson RFPD stand will highlight GaN driver technology, including half-bridge (12 Vin to 1.2 Vout) and Class D audio.

Power Integrations SCALE-iDriver ICs for IGBTs and MOSFETs up to 1200V will be showcased alongside the Powerex Mitsubishi 7th Generation low loss silicon IGBTs and Vincotech’s low profile 1200V VINco E3 modules with high power density and low stray inductance, 300 A, 450 A, 600 A and 690 A with press-fit or solder pin options.

Wakefield-Vette standard liquid-cooled solutions in three families: exposed, full buried and rolled tube and Wolfspeed’s expanded third generation SiC MOSFET platform in 4L TO-247 and 7L D2PAK packages will also be featured.