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Next-gen airborne particle sensor tech showcased at SEMICON

9th February 2017
Alice Matthews
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Global developer and manufacturer of high precision 3D sensing technology solutions, CyberOptics, has announced it will demonstrate its next-gen Airborne Particle Sensor technology (APS2) with an extended particle size range at SEMICON Korea, February 8th-10th at the COEX in Seoul, booth 2220.

CyberOptics’ APS2 portfolio speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. The next-gen APS2 provides even greater versatility as well as the expected accuracy and sensitivity valued by semiconductor fabs and equipment OEMs worldwide.

Both the WaferSense and ReticleSense Airborne Particle Sensors (APS2, APSR and APSRQ) can measure small and large particles. The new large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.

“Our APS2 sensors are widely used to detect, identify and monitor airborne particles in the leading semiconductor fabs around the globe,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Extending the measurement capability range in the same device provides an efficient solution for our customers that improves yields.”

At SEMICON Korea, CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and Relative Humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.

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