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MEMS & Imaging Sensors Summit

12th September 2024
Sheryl Miles
0

The SEMI MEMS and Imaging Sensors Summit, themed ‘Sensor Revolution for a Connected Future,’ will gather top sensor technology experts on 14th November 2024 at the International Conference Centre Munich (ICM), Germany. Registration is now open.

Organised by SEMI Europe and the MEMS & Sensors Industry Group, the summit will feature innovations in wearable health monitoring, scalable 300mm MEMS manufacturing, and energy-efficient AI for visual applications. Attendees will also explore hyperspectral imaging, LiDAR for autonomous vehicles, and sustainable sensor technologies advancing healthcare, smart mobility, and sustainability.

Laith Altimime, President of SEMI Europe, commented: “As the MEMS and imaging sensors landscape continues to evolve, we’re witnessing rapid advancements in technologies like AI and machine learning, opening doors to innovative applications that are transforming industries. We are excited to bring together industry leaders at this year’s summit to explore how these cutting-edge technologies are coming together to enable sustainable growth and shape a connected future.”

Featured speakers include:

  • Stefan Finkbeiner, CEO, Bosch Sensortec
  • Simone Ferri, AMS Group Vice President, MEMS sub-group General Manager, STMicroelectronics
  • Charbel Rizk, Founder & CEO, Oculi
  • Jessica Gomez, CEO, Rogue Valley Microdevices
  • Eric Aguilar, CEO, Omnitron Sensors, Inc.
  • Avi Bakal, CEO & Co-founder, TriEye
  • Markus Arzberger, Senior Director, ams OSRAM
  • Thomas Uhrmann, Director of Business Development, EV Group
  • Jussi Soukkamaki, Lead, Hyperspectral & Imaging Technologies, VTT Technical Research Centre of Finland Ltd
  • David Springer, Product Manager, MVD and Release Etch Products, KLA Corporation

Leading exhibitors include:

  • AGP Co., Ltd
  • CEA-Leti
  • COMET Yxlon
  • EDA Solutions Limited
  • Eurofins | MASER
  • FormFactor
  • LAM Research
  • Philips MEMS & Micro Devices
  • Polyteknik AS
  • Pyxalis
  • QP Technologies (formerly Quik-Pak)
  • Schott AG
  • scia Systems GmbH
  • Shenzhen Angstrom Excellence Technology
  • Spraying Systems Deutschland GmbH
  • Ushio Inc.

Premier sponsors:

  • Platinum Sponsors: Comet Yxlon, Infineon, KLA
  • Event Sponsors: STMicroelectronics, Teledyne MEMS

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