At productronica China 2025 (from 26-28 March) MacDermid Alpha Electronics Solutions will showcase breakthrough materials designed to meet demands for enhanced performance and reliability.
The demand for higher power density, miniaturisation, and sustainability in electronics is driving the need for innovative materials that enhance performance and reliability. ALPHA HiTech CF31-4026 by MacDermid, a reworkable edgebond, supports these advancements by facilitating more compact, durable designs while extending product life and reducing electronic waste - aligning with the industry's focus on repairability and cost efficiency.
At the same time, Kester Indium sTIM (Solder Thermal Interface Material) overcomes thermal challenges in AI, EVs, and 5G infrastructure, ensuring efficient heat dissipation and reliability in increasingly power-intensive applications.
With devices becoming smaller and more powerful, reliability and heat dissipation are essential. ALPHA HiTech CF31-4026 improves structural integrity with high thermal cycling durability, leveraging a high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) to prevent stress-induced failures. Its design lowers costs and waste, while strong adhesion ensures stability in high-density applications.
Thermal management remains a challenge for power electronics. Kester Indium sTIM, alongside Argomax Solder Preforms and Atrox solutions, enhances heat dissipation, preventing performance degradation and extending device lifespan. Its fine-feature compatibility and advanced wetting properties ensure reliable thermal transfer in compact semiconductor designs. These innovations address the important need for durable, high-performance electronics in an evolving technology landscape.
“MacDermid Alpha is dedicated to solving reliability and thermal management challenges for industries like automotive electronics and high-performance computing,” said Marc Lin, General Manager, Greater Asia. “Our latest TIM and sTIM solutions extend device longevity, while ALPHA HiTech CF31-4026 enhances efficiency without sacrificing performance. By integrating innovation with sustainability, we are delivering materials that drive the future of power electronics.”
