MacDermid Alpha boosts semiconductor reliability at IMAPS 2024

MacDermid Alpha will feature key technology innovations that enable advanced packages to meet the semiconductor industry’s demand for performance and reliability. 

Accelerate development and enhance reliability

Experts from MacDermid Alpha will present two papers during the IMAPS Conference.

Discover how to enhance device reliability, a paper titled ‘Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films’ will be presented by Dr. Abdelhamid ElSawy, on March 19, at 2pm session TP1.

The second presentation, ‘An Innovative OSP Surface Finish for IC Substrate Packaging Applications’ takes place on March 21, at 10am session THA2. Dr. Frank Xu will reveal the significance of OSP Surface Finish for IC Substrate Packaging Applications in addition to the correlation between coatings, cleaning agents, and other variables that dictate the effectiveness of OSP.  

Leading-edge technology solutions for semiconductor applications

MacDermid Alpha will focus on its advanced interconnect metallisation and assembly innovations that empower semiconductor designs. From solutions for IC substrates including the Systek family of high-performance build-up processes, to our ViaForm copper damascene technologies for wafer fabrication. In addition to solutions for power electronics including the ALPHA Argomax engineered sinter materials and Atrox PFAS-free conductive die attach products. These solutions enable enhanced reliability and reduced time-to-market for advanced packages.

Unlock your semiconductor potential with the broad range of high-performing products and processes from MacDermid Alpha at booth 13–14.