At this year’s PCIM Europe, Lotus Microsystems ApS, will showcase a portfolio of advanced power solutions designed to meet the increasing demands for miniaturisation, thermal efficiency, and system integration in next-generation electronics.
With a focus on power-dense architecture and compact thermal management, our technologies are engineered for engineers to build the future of AI, Edge computing, and low-power IoT.
On display
- LMU20P1 – high-efficiency boost converter
An ultra-compact and efficient boost converter tailored for low-power applications such as energy harvesting, IoT nodes, and wearables
See the LMU20P1 in action with our compact evaluation platform, designed for real-world testing in low-power, high-efficiency applications. Engineers can assess startup behaviour, load response, and efficiency under dynamic conditions
- Lotus power interposer technology
Silicon integration platform combines passives, control, and power switches – enabling unmatched power density, miniaturisation, and thermal performance
- LTG – Lotus thermal guide
Intelligent thermal routing solution enhances heat dissipation in ultra-compact systems, making it ideal for high-performance, space-constrained designs
Debuting at PCIM Europe 2025, this evaluation board demonstrates the effectiveness of our LTG devices. Measuring 35 x 35mm with a two-layer design, 35μm copper thickness, and a total board thickness of 0.8mm, it has been characterised using FLIR A70 under ambient conditions. The device is stressed to stabilise at approximately 150°C without thermal aids, serving as a reference for the performance of our LTG devices.
Redefining power management
Lotus Microsystems is pushing the limits of integration and thermal engineering to deliver smaller, cooler, and more efficient systems. Stop by our booth and see how we’re enabling the next generation of compact, high-performance electronics.
