Latest solder technology developments on show at SMTAI

With proven reliability in a range of electronics assembly products, the SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The alloy provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering, hand soldering and reflow applications.

Able to be stored at room temperature for more than 150 days without deterioration, SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste which simplifies stock management and improves productivity with excellent consecutive printability.

Complying with the requirement of the EU RoHS Directive, SN100C P604 D4 is a lead-free and completely halogen-free solder paste. The SN100C P604 D4 does not use any chemicals requiring special registration under the EU REACH legislation without performance or reliability compromises. This was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.

A general purpose flux-cored lead-free solder wire that offers improved productivity, the SN100C (031) provides excellent wetting for components with poor solderability. The solder wire provides high first pass yields, low flux spattering, high insulation resistance and fast sequential soldering for high reliability and productivity.

Alconano Nano-Silver Paste makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in Nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the particles and strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure.