KIOXIA at Mobile World Congress 2024
KIOXIA Europe announced that it is participating at this year’s Mobile World Congress in Barcelona from 26-29 February 2024.
KIOXIA will join Hewlett Packard Enterprise (HPE) at booth 3N10 in Hall 3 to present their collaboration on the recently launched HPE Spaceborne Computer-2 to conduct scientific experiments at the International Space Station (ISS).
KIOXIA will be featuring its flash memory-based product lineup of Value SAS and NVMe SDDs (RM, CM and XG), the robust flash storage provided to HPE’s Spaceborne Computer-2 comprising EdgeLine and ProLiant servers. Flash memory-based SSDs can withstand the harsh outer space environment as they are less susceptible to electromagnetic waves and have no moving parts, unlike hard disk drive storage. SSDs can deliver faster performance, power efficiency and reliability required.
Overall, KIOXIA provided eight 1,024 gigabytes (GB) NVMe, four 960 GB value SAS SSDs and four enterprise SAS SSDs, each 30.72 terabytes (TB). With more than 130 TB, this is the highest amount of data storage to have ever travelled to the space station on a single mission.
“We are looking forward to joining HPE at their stand 3N10 in Hall 3 at Mobile World Congress,” said Paul Rowan, Chief Marketing Officer & Vice President at KIOXIA Europe GmbH. “Partnering for many years with HPE, our collaboration extends to a broad range of HPE solutions from mobile to Cloud and enterprise applications.”
Beyond this collaboration, KIOXIA will also show its Enterprise SDD and Datacenter SDD line-up, highlighting Enterprise Datacenter Storage Form Factor (EDSFF) E3.S at the executive meeting rooms in Hall South Village. In addition, visitors will be able to learn more about the company’s e-MMC and UFS storage solutions based on BiCS FLASH 3D flash memory. While e-MMC is ideal for applications requiring less density such as streaming media devices, printers, wearables, and IoT devices, Universal Flash Storage (UFS) 4.0, a JEDEC-standard, non-volatile managed flash device, is designed for high-performance embedded applications in smartphones, automotive systems, tablets, smart speakers, and AR/VR devices.