KIC soldering and curing processes revolutionises electronics manufacturing

The event will take place on 14―17 November 2023, at the esteemed Trade Fair Centre Messe München. Miles Moreau, General Manager, will be on-site in Hall A4, Stand 214 along with the KIC Europe team to engage with industry experts and engineering professionals, and discuss the latest developments and innovations.

At the event, KIC will highlight its advancements in process optimisation and recipe refinement strategies as well as their latest sensing technologies. These innovative solutions are designed to address challenges related to defects reduction, improved overall equipment effectiveness (OEE), product quality, oven performance tracking, and innovative thermal profiling methodologies.

The dynamic landscape of electronics manufacturing, especially within the automotive, medical, and aerospace sector in Europe, demands intelligent utilisation of extensive data to foster flexible, efficient, and successful manufacturing operations. KIC’s ‘Heat to Data’ approach presents a comprehensive ecosystem encompassing all facets of electronics assembly and semiconductor packaging thermal processes.

The company's solutions tackle the challenges of temperature profiling, process setup, and inspection/monitoring, while also facilitating automation, traceability, and connectivity across diverse sectors including automotive, medical, aerospace, network, and military markets.