KIC contact-less thermal analysis at SMTA Dallas

In response to the ever-evolving challenges faced by today's manufacturing industry, KIC is proud to introduce contact-less thermal analysis, a revolutionary advancement in electronics manufacturing. This groundbreaking technology directly measures board temperatures during production, enabling real-time monitoring of temperature and convection changes.

KIC's Contact-less Thermal Analysis is designed to redefine precision in reflow profiles by directly measuring board temperature at the end of the heated section of the reflow oven during production. This innovative capability ensures unparalleled accuracy and quality in monitoring the oven's influence on production boards, marking a monumental leap in reflow process inspection technology.

Furthermore, KIC will be introducing its new profiling software platform, Thermal Analysis System, with the addition of a new recipe optimisation search mode called Common Recipe Finder. The Thermal Analysis System software offers a state-of-the-art User Interface, allowing complete flexibility in reflow and wave recipe setup with a ‘browser-like’ user experience. Common Recipe Finder allows you to find a single recipe for multiple assemblies, streamlining your changeover time, and improving equipment utilisation and OEE.

Visit KIC at the SMTA Dallas Expo & Tech Forum to engage with thermal process experts, learn more about contact-less thermal analysis, and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging.