HEITEC at Embedded World 2016

When closed, the case reflects the modularity of a standard housing. When open and 'unfolded', it shows the potential of standard 19'' housing technology from the component to the platform as well as a complex 'TO GO' system solution, including sensors, measurement equipment, electronics, automation, wireless machine-to-machine communication, SAP integration and user interfaces, all closely linked and integrated in an attractive standard Vario Module housing from HEITEC. The demo illustrates in practice, how software, mechanics and electronics can interact successfully in order to implement not only Industry 4.0 but also today’s actual challenges in the industry.

The housing part of the demo - integrated in a HeiPac Vario sub-rack - represents the plentitude of alternatives within the HEITEC packaging systems based on only one product family, which includes a large number of variations, from mechanical standard components to customer specific small-scale systems. The solution consists of a 6U HeiPac Vario standard sub-rack, which can be flexibly divided to 3U or 6U. It is also available as EMC version.

The built-in components such as rails, plates, EMC devices, different ejector levers and handles, and not least the maintenance-friendly installation demonstrate the countless variations that are possible with the standard technology and its wide range of accessories. In addition, a stainless steel housing for DIN rail mounting presents a custom solution that may dispense with elaborate fittings. Also, adapted rails, specific cutouts and a knurled gland underline the vast variety of designs.

The electronic systems integration part of the demo - integrated in the Vario Module case - incorporates everything that is needed to implement a networked production and for complex control tasks: A microcomputer with a 7” multi-touch screen, a PLC with operating panel and a variety of communication interfaces such as Ethernet, WLAN or Bluetooth. So you can transmit sensor data from a smartphone via radio or from the controller via cable in real time, and have them analysed and visualised. Or you can establish an online communication to an SAP server to promptly retrieve production orders and report partly finished or fully processed jobs back to the SAP IT - all in a manner understandable to the operator of a machine. The apps are as intuitive to use as those for Android or iOS. They are realised across various operating systems with C++/Qt based on a small microprocessor running Linux.

When closed, the case based on the HeiCase housing family demonstrates the modularity of a standard system chassis. When open, it unfolds the versatility of HEITEC’s housing technology and systems integration expertise, which can be tailored specifically to the customer’s requirements and the requirements of the applications. Compact and plastically ‘packed’, the case immediately gives an impression of the performance of both models, which can be combined as needed. The cases are also successfully used as sales tools.