Gold stencil & solder paste range on show at Expo & Tech forum

The NanoSlic Gold stencil, next-gen stencil technology, is developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste.

NanoSlic Gold is thermally cured and is a permanent coating. The NanoSlic technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic minimises bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.

FCT Assembly offers solder pastes that are specially formulated to solve various issues during the assembly process, including anti-tombstoning, low graping, low voiding, low melting, high activity and more. The product line is separated into leaded vs. lead-free. For leaded pastes, FCT sells 63/37, 62/36/2 and high-temperature leaded alloys. Lead-free alloys include SAC305, SN100C, SAC387, SAC307 as well as other HMP alloys. These typically come in Type 3, Type 4 and Type 5 particle sizes. 

In addition to its line of solder paste, FCT manufactures other products that reduce defects and increase yields during the printing process including laser cut stencils and stencil coatings.