Solder inspection system debuts at Nuremberg event

16th April 2015

Mick Elliott

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A variety of optical/X-Ray inspection and JTAG/Boundary Scan solutions will be demonstrated by GOEPEL electronics at the SMT/Hybrid/Packaging show in Nuremberg (May 5-7). Visitors will see how electronic manufacturing can be optimised, errors can be minimised and production costs can be decreased through significant innovations expected this year.

The AOI software system “PILOT 6” will be presented with major advancements. It is characterised by comfortable and fast test program generation in app style – especially valuable for inexperienced users.

Making its debut will be “PILOT Connect”, a system that links all data for automated optical, solder paste and X-ray inspection. This interface collects and centrally manages the machine and operating data of the connected systems and merges all test data onto one repair and verification station.

Comprehensive high speed X-ray inspection will be provided by the inline 3D AXI system X-Line 3D. AXI+AOI=AXOI, is the formula behind a combined AXI/AOI system that provides the ability to see past the surface, beyond the “tip of the iceberg” and into the hidden details so often critical for ultimate product quality.

The entirely new solder paste inspection system SPI-Line 3D offers maximum flexibility at maximum speed. Due to the large z-axis range, even the smallest feature sizes, such as with sintering paste, can be accurately measured.

The GOEPEL electronics business unit, JTAG/Boundary Scan, completes the formula for highest error and test coverage. The brand new ChipVORX module FXT-X32/HSIO4 allows testing of high-speed bus systems such as USB 3.0, PCIe and eSATA. The CION-LX Module FXT96 is the latest generation module for testing analogue, digital and mixed signals applications, using the world’s first JTAG controllable Tester on Chip (ToC).