Fairchild power seminars focus on "Engineering Energy Efficiency"

This seasons’ power seminar series – themed “Engineering Energy Efficiency” – is a comprehensive one-day seminar providing rich technical and practical presentations that combine new, advanced power supply concepts, tutorial review of basic design principles, and “hands-on” real-world application examples.

The focus of Fairchild power seminars is on technologies and techniques, not products. The new topics for 2013-2014 range from:

• advanced or emerging power technologies (critical design issues of LLC resonant converters, current shaping strategies for buck PFC),
• design issues in key applications (low-voltage DC-DC converters, high power HB-LEDs),
• design examples (rapid-iteration flyback design).

The seminars are ideal for engineers looking for the latest advancements in power supply design, as well as those looking for a refresher. The attendees will receive in-depth theoretical and practical discussions on each topic and pros and cons of different solutions to improve energy efficiency and system performance. Each of the presentations is accompanied by a technical paper with the full in-depth treatment of the topic for reference.

The 2013-2014 Power Seminar technical sessions include:

• The LLC Resonant Converter: Design Issues and Solutions – highlighting the critical design issues of the LLC resonant converter including synchronous rectification and discussing potential solutions to solve them.
• Driving HB-LEDs in High-Power Industrial Fixtures – addressing some of the specific challenges designers face when considering power supply design solutions for HB-LED lighting applications.
• Current Shaping Strategies for Buck Power Factor Correction – discussing two possible control techniques for a buck PFC converter, where the input current is indirectly shaped by shaping the inductor current.
• Improve Flyback Design Performance with a Rapid Iteration Approach – highlighting capable design software that enables an engineer to optimize a circuit by comparing the performance of many different design alternatives in a short time.
• Evolution in Packaging for Optimum Efficiency and Size in Low Voltage DC-DC Applications – focusing on the advantages of co-packaging two power MOSFET die along with a gate driver IC die to form a low voltage, high current multi-chip module synchronous buck power stage.

European locations/dates:

Registration information:

Locations, schedules and descriptions of each technical session, as well as registration information, is available at: fairchildsemi.com/powerseminar.

Registration is limited at each location. Anyone wishing to participate should register as soon as possible. There is a $75 per person registration fee for these full-day seminars, which includes a continental breakfast, lunch, a copy of the seminar presentation material and corresponding white papers.