Empower Semiconductor to present at Chiplet Summit 2024

Trey Roessig, the CTO and SVP of Engineering at Empower, will deliver a talk titled ‘Using Integrated Voltage Regulators in Chiplet Design’ on 7^th February at 3:15pm PST, as part of the design/security track.

Empower's IVRTM technology has an innovative power management architecture, providing power with simplicity, speed, and accuracy through a single IC, eliminating the need for external discrete components. These devices find use in both traditional system power applications in space-limited settings and as a power chiplet within SoC or chiplet-based architectures. When combined with Empower’s E-CAP silicon capacitor products, these in-package integrated voltage regulators offer compactness, performance, and power integrity.

The rise of chiplet-based multicore designs has intensified power delivery challenges. The varied power requirements of different chiplets add complexity to power conversion design, significantly impacting the overall solution footprint. Empower Semiconductor's presentation will explore how high-frequency IVRs, integrated inside a package as a power chiplet, can eliminate most external power converters and large inductors. This method simplifies package design by removing numerous dedicated power balls and external traces, thereby reducing transmission losses, and enhancing transient performance.

Roessig commented: “Our IVRs not only increase the overall performance of chiplet-based devices, but they also greatly simplify the implementation of the multiple power domains required. We save critical board space, and power engineers are surprised at how seamless and flexible designing in-package power conversion is. We are excited to present the unique benefits of the Empower IVR technology at the upcoming Chiplet Summit.”