DAC 2014 presentation to focus on 28nm SoC design

Gianvito Lorusso, Engineering Manager at Sondrel’s Milan office, will cover the many challenges experienced taping out such a large design on a 28nm node and explains how Sondrel’s Neon methodology, coupled with the Helium tool suite, was used to overcome them.  The initial part of the presentation gives an overview of the company’s approach to successfully managing complex design projects in multi-site, multicultural environments, where communication is key.  More technical aspects of the project are also divulged, including achieving the power target, ocv, and managing crosstalk contamination on the main clock trunks, chip assembly optimisation and signoff- driven routing. To conclude, Lorrusso will present a summary of lessons his team learnt and share some valuable tips and practices to achieve a successful tape out.

This year’s Design Automation Conference (DAC) will be held in San Francisco, between June 1 – 5 2014.  DAC is one of the highlights in the semiconductor industry’s calendar and this year’s exhibition and conference is expected to attract a record number of executives from all major participants in the global semiconductor ecosystem.