Cambridge GaN Devices at PCIM 2024

28th May 2024

Paige West

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Cambridge GaN Devices (CGD) will take the opportunity afforded by PCIM (Nuremberg Messe, 11-13th June) to demonstrate how the company’s product portfolio is developing to address higher power applications such as motor drives, inverters and data centres, as well as lower power, ultra-compact smart portable device adapters and chargers.

As well as introducing a new product family, and showing a selection of informative demos on its booth (Hall 7 stand 643), CGD will have a very visible presence around the show with various presentations.

15.00, Tuesday 11th June, Hall 9-642: Dr Giorgia Longobardi, CGD’s CEO, will formally launch the company’s latest ICeGaN 650V family of GaN ICs, targeting applications in the 1 to 5kW range.

13.30, Tuesday 11th June, Technology Stage (Hall 7 Stand 743): CGD’s CTO, Professor Florin Udrea will take part in a panel discussion hosted by Markt & Technik Editor, Engelbert Hopf.

14:20, Wednesday 12th June, Technology Stage (Hall 7 booth 743): Professor Udrea will be part of a panel discussion hosted by Bodo’s Power Systems, entitled ‘GaN Wide Bandgap Design, the Future of Power.’

14.10, Thursday 13th June, Technology Stage (Hall 7 booth 743): Di Chen, Director of Business Development & Technical Marketing, CGD, and José Quiñones Staff Applications Engineer at Qorvo will share the stage with a joint presentation ‘GaN Power ICs and Power Application Controller Optimise Performance in BLDC and PMSM Motor Drives.’

Andrea Bricconi, Chief Commercial Officer, CGD said: “With its inherent ruggedness and reliability, our ICeGaN GaN ICs are perfectly suited to meet the needs of higher power applications such as data centres and inverters. Our presentations and demos and the new devices which we are launching at the show will illustrate our capabilities for these markets.”

CGD’s Booth (Hall 7 643) will feature reference designs, evaluation boards and demos that support the company’s existing business in chargers and adapters as well as the new higher power applications. New exhibits include:

Very high power density (30W/in3) 140W reference design produced with the Taiwanese Industrial Technology Research Institute (ITRI) board
Single leg of a 3-phase automotive inverter demo board, developed in partnership with French public R&I institute, IFP Energies nouvelles
Two half-bridge evaluation boards with new thermally-enhanced DFN package designs
A 2.7kW totem-pole power factor correction demo board
Qorvo motor drive evaluation kit using ICeGaN
Demo comparing a half-bridge circuit realized using ICeGaN vs discrete e-Mode GaN

Bricconi said: “The power electronics world has swung irrevocably in favour of GaN. Visit CGD during PCIM to experience the world’s easiest-to-use GaN, so your application can benefit from GaN’s greater efficiency and higher power density now, without any design delays.”