Awards presented at SMTA China

IBM Procurement China Limited’s Robin Hou was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge and Solution for Rework of Array Components.”

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference Two for the paper titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process.”

Pacrim Technology Inc.’s Dr. Wayne Koh received the award for The Best Presentation of Technology Conference One for the presentation titled “Package Warpage Control and SMT Solder Joint Defects.”

Jason Chan, from KYZEN, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Video Analysis of Solder Paste Release From Stencils.”

Jason Chuah, from Kirsten Soldering AG,received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Breakthrough of THT Soldering Solution.”

Dragon Zhang, from BPM Microsystems, received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The Landmark Innovation for Device Programming.”

Kirsten received the award for The Best Emerging Exhibit of the Year 2016 China South with the product “Modula The Soldering System,” Model “The Modula Wave.”

BTU received the award for The Best Exhibit Technology of the Year 2016 China South with the product “Reflow Oven”, Model of “PYRAMAX 125N.”