Automotive IP and design solutions displayed at embedded world

• ADAS: The scalable Cadence Tensilica DSPs offer ease of use, which significantly reduces the development time of high-performance, low-power ADAS designs for deep learning/neural networks, vision, lidar and radar processing applications.
• Automotive Ethernet: Cadence Ethernet IP enables engineers to quickly design low-cost, high-speed Ethernet communication links between ADAS, infotainment and other ECUs for increased safety.
• Functional safety: Cadence tools and flows and ASIL-B-ready interface IP enable customers to significantly minimise the ISO 26262 functional safety compliance effort for automotive SoCs through automated fault injection, simulation and result analysis.
• Infotainment: Tensilica HiFi DSPs enhance the infotainment experience by offloading the main CPU for lower power voice recognition, immersive surround sound, active noise control, engine sound design and digital radios.
• ECU design: The Cadence Sigrity solutions for Power Integrity (PI) and Signal Integrity (SI) analysis offer integrated design and analysis with Cadence Allegro PCB design technology. Sigrity PowerDC technology provides thermal hotspot identification.
• Microsoft HoloLens: Customers can experience a mixed-reality world with the Microsoft HoloLens powered by 24 Tensilica processors.
• FPGA-based prototyping: The new Cadence Protium S1 FPGA-Based Prototyping Platform incorporates innovative implementation algorithms and front-end congruency with the Cadence Palladium Z1 Enterprise Emulation Platform that reduces design bring-up time by an average of 80%.

embedded world 2017 is scheduled from March 14^th-16^th 2017. Cadence is located in hall 4, booth 4-116 at the Exhibition Centre in Nuremberg, Germany.