ASC International to exhibit at SMTA

VisionPro HSi is a high-speed, sophisticated 3D solder paste measurement system coupled with an intuitive Windows user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGAs and many other PCB features. The VisionPro completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It also will include AOI inspection of PCB assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities.