AOI is turned on its head at Productronica

On hand in Hall A2 on Booth 403, the MEK team delivered live demonstrations to validate the company’s promise of genuinely unique AOI capability. These demonstrations included: the PowerSpector FDAz inspection head, which introduces a new era in capture quality; the FDAz inspection head, which enables 9 Camera AOI featuring Tilt-Shift & Telecentric optics with automatic Z-axis; and 8 Side cameras in 10µ resolution with Tilt-Shift optics technology. Already familiar in architectural photography, these new product innovations reduce image distortion to enable the best capture possible. A moveable head in Z-Axis brings objects into optimal focus and position, independent of PCB thickness or warping. Unprecedented defect visibility is achieved when used in combination with the HD 18.75µ or 10µ resolution top camera with Telecentric optics and unique multiplexed 8x CameraLink side camera technology.

Ideally engineered to accommodate solder frames on return and/or feed conveyors, the SpectorBox “Bottom-Up” Modular AOI system was publically exhibitted for the first time. SpectorBox offers bottom side, top side or simultaneous dual side inspection, deploying up to 18 cameras, Z axis positioning and auto-focus.

Advancing Automatic Solder Paste Inspection, the Mek 5D SPI PowerSpector S1mkII features patented advanced sensor technology with simultaneous 3D and 2D inspection to lower SPI process parameters to unmatched levels and extend SPI capabilities beyond any offered by 3D alone. True area, shape, volume, offset and height measurements are provided in combination, providing genuine process control and a perfect tool with which to adjust printer settings before a problem spreads throughout an entire production run.