Active-PCB Solutions to exhibit at ESLive

The company ranks among the very best in its sector and is renowned for its responsive, fast turn solutions for small to medium batch, high-complexity assemblies. Large batch volume capability covers complex technologies like flip-chip, package-on-package (PoP), Micro BGAs, QFNs and exacting Ultra Fine Pitch work. This is backed up by outstanding repair, rework and refurbishment expertise with resources that include X-ray validation for BGA rework and QFN rework.

Production capability is further strengthened by a robust strategic business partnership in China. Through this channel, Active-PCB Solutions manages assemblies from prototype concept to competitive volume production, without compromising product or build quality.

Active-PCB Solutions also offers sophisticated test and AOI resources to fully verify assemblies, full supply chain management and systems assembly and final box build that can include wiring, potting and conformal coating.

Gary Turner, MD, Active-PCB Solutions, comments: “Active-PCB Solutions has been manufacturing for OEMs in the EMS market since 1997 and our expertise continued to grow over the ensuing years. Our specialised skill and experience in NPI is a key contributor to our success as a high quality manufacturing services company. We welcome a large diverse customer base who appreciate our wide range of engineering services and the consistent high quality work product we provide. Our extensive capitalisation and manufacturing techniques allow NPI to peacefully and successfully co-exist alongside volume production.”