Events News

Lauterbach have today revealed that they have agreed to be a key sponsor of next year's Device Developers’ Conference. This one-day event will be run in Bristol, Cambridge, Manchester and Scotland during May 2014, and will provide half-day technology workshops, technical presentations and an exhibition. The event is aimed at engineers and computer scientists working in the development of intelligent systems and devices.

GaN Systems has today announced that a team of its experts on gallium nitride technologies will present a major conference paper at the 224th ECS Electrochemical Energy Summit (San Francisco, California October 27 – November 1). Authored by Tom MacElwee, John Roberts, Hughes Lafontaine, I. Scott, Greg Klowak, and Lyubov Yushyna, the “Characterisations and performance of D-Mode GaN HEMT transistor used in a cascode configuration”...

API Technologies announced today that it will be exhibiting the ION SA5600-SAL: Avaya SAL Edition, along with its full line of ION enterprise products, at the annual International Avaya Users Group Conference (Booth #333). IAUG CONVERGE2013 takes place June 4-6 at the Gaylord Palms Resort & Convention Center in Orlando.

Mek is pleased to announce the release of an entirely new generation of AOI technology to be deployed across a line of new Desktop and In-line inspection machines. The new generation of AOI technology will be on show at SMT Nuremberg.

Today at the Applied Power Electronics Conference & Exposition (APEC) 2013, Infineon Technologies introduced the highly efficient, fast recovery 650V 650V Rapid 1 and Rapid 2 silicon diode families. Combining Infineon’s ultrathin wafer manufacturing expertise for a low loss vertical structure plus unique cell design, the Rapid diodes provide outstanding performance.

BPM Microsystems announces that its model 3800 automated programming system is now available with a side-mount option for the V-TEK TM-50 tape output media. This reconfiguration offers additional flexibility by allowing the machine to utilize options for tape, tray, tube and marking simultaneously.

Super Dry will feature their award winning oxidation free component and PCB drying technology at booth #504 during February’s IPC APEX Exhibition in San Diego. The process will be highlighted there in the Super Dry XSD 701 desiccant dry cabinet. Designed to exceed the formidable challenges associated with IPC J-STD-033C and 1601 for handling Moisture Sensitive Devices, XSD desiccant cabinets deliver a process combining ultra low humidity (&...

Barr Group is pleased to introduce the Embedded Security Boot Camp, the newest entry in its respected Boot Camp Series of embedded systems training courses. The first offering of this new course will be in California on May 6-10, 2013.

FCT Assembly announces that Sergio Juarez, Sales Manager Mexico & C.A., held a successful presentation at the recent SMTA Austin Expo and Tech Forum that took place on Wednesday, September 26, 2012 at the Norris Conference Center in Austin, TX. Juarez’s presentation entitled “Impact of Strain on Lead-Free Alloys” was well attended and accepted by the audience.

Essemtec will introduce its high-performance dispenser Scorpion at the upcoming CiEN exhibition in Paris. With an accuracy of 51µm (3σ) and a dispensing performance up to 100,000 points per hour, Scorpion is among the best dispensers in the world. Additionally, Essemtec will present the highly flexible SMT pick-and-place system Paraquda.