Events News
Panasonic Presents Latest Smart Home and Automotive Applications at Electronica 14
Panasonic Automotive & Industrial Systems Europe (PAISEU) which combines the decades of experience from Panasonic Automotive Systems Europe, Sanyo Components Europe, Panasonic Industrial Devices Sales Europe and Panasonic Electric Works, will exhibit for the first time, as a newly founded consolidated company at Electronica 2014 – Munich, Germany, November 11-14.
Connectivity & sensor technologies at electronica
TE Connectivity is unveiling its highly engineered, cutting edge connectivity and sensor technologies at electronica, in B3.225. TE will highlight its portfolio of intelligent, efficient and high-performing solutions in use by customers across several industries, including automotive, industrial & commercial transportation, aerospace, defence and consumer applications.
DrMOS power stages meet design challenges in POL applications
Vishay Intertechnology arrived at the electronica exhibition in Munich with a new family of VRPower integrated DrMOS power stage solutions in three PowerPAK package sizes to meet the various design challenges in high-power and high-performance multiphase POL applications. The SiC789 and the SiC788 are offered in the MLP66-40L with an Intel 4.0 DrMOS Standard (6 mm by 6 mm) footprint.
Power connectors resist extreme temperatures
In response to demands from customers requiring a resilient power connector, Harwin, has launched a family of high density power connectors that can handle currents up to 10A and withstand temperatures between -65degrees C and 175 degrees C. Based on a 3mm pitch, the M300 connectors are designed for rugged environments and withstand twice the number of operations as older generation products.
Cambridge Wireless announces speaker line-up for Technology Conference 2015
A strong line-up of speakers has been announced for the first Cambridge Wireless Technology Engineering Conference (CW TEC) in London on the 24th March 2015.
SMART Group’s One-Day 3D AOI Seminar at MTC to Focus on Myth Busting & New Technology
SMART Group announces that it will present “Advances in AOI Technology: 3D AOI, Exploding the Myths and Looking at New Technology,” a full-day event on Tuesday, 2nd December 2014 from 0930 to 1600 at the Manufacturing Technology Centre (MTC) in Anstey Park, Coventry.
Microsemi to Present “Security for the Internet of Things: Challenges and Solutions,” During Electronica 2014’s Embedded Forum and Participate as a Panel Member as Part of the Event’s Security Forum
WHAT: Microsemi Corporation will participate in Electronica 2014’s Embedded Forum with a presentation titled, “Security for the Internet of Things (IoT): Challenges and Solutions” that outlines using advanced security features of its SmartFusion2 SoC FPGAs and IGLOO2 FPGAs. Microsemi will also participate as a panel member at Electronica’s Security Forum.
Rittal’s RiMatrix S Data Centre roadshow venues
Packed into a shipping container on the back of an articulated lorry, Rittal’s RiMatrix S will again be at DatacenterDynamics Converged London 2014.
Ford President and CEO Mark Fields to Debut on 2015 International CES Stage
The Consumer Electronics Association today announced that Ford Motor Co. president and CEO Mark Fields will deliver a keynote address at the 2015 International CES. Owned and produced by CEA, the 2015 CES, the world’s gathering place for all who thrive on the business of consumer technologies, will run January 6-9, 2015, in Las Vegas, Nevada.
Pre-wired rack meets high power DC applications
Citing the challenge of building high power racks, Keysight Technologies launcheda rack system for high-power DC applications at the electronica exhibition in Munich. Because design engineers and technicians tend not to be experienced in high power racking, this new prewired N8900 Series rack system reduces system complexity and saves time for engineers designing and implementing high-power systems for challenging applications requiring up to 90 ...