Events News
Warsaw event hosts splicer demo
Fujikura Europe is presenting its fusion splicing and connectivity solutions at FTTH Council Europe’s 2015 conference and exhibition in Warsaw. CTTS training services will be running the product demonstrations and interactive hands-on workshops, titled ‘The Fundamentals of FTTH Networks Engineering - Training, Testing, Connectivity’, and featuring the world's smallest and lightest single fibre splicer, Fujikura’s 12S...
Acquire Digital to exhibit multi-touch application at ISE
At ISE (Integrated Systems Europe) 2015, which takes place from 10th to 12th February, in Amsterdam, Acquire Digital will showcase its latest multi-touch application, alongside hardware partners, including Panasonic and Sony.
High speed design conference draws upon expert knowledge
From 5th to 7th May this year, Leonardy Electronics will host its High-Speed Design conference for the third time, in co-operation with Altium. The event consists of individual modules, allowing participants to register for either one, three or four days. On May 8, there will be an opportunity to book an additional training session with an Altium Designer expert.
Mouser/TTI on parade at Southern show
Visitors to the Mouser Electronics stand at Southern Manufacturing and Electronics (Feb 10-12) who signing up for Mouser's new product and application newsletters also have the chance of winning an iPad Mini. Mouser Electronics is exhibiting at Southern Manufacturing & Electronics (Feb10-12) with sister Berkshire Hathaway company, TTI.
GIL 2015 explores connectivity & convergence
Connectivity and convergence is the theme of Frost & Sullivan's GIL (Growth, Innovation and Leadership) 2015: Europe. The GIL congress returns to London for its seventh consecutive year on Thursday 14th May at Royal Garden, in Kensington. Over 200 industry leaders are expected to convene from all over Europe to share ideas and strategies to make their business choices successful.
Yole explores the power electronics industry
According to Yole Développement, Wide Band Gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is how? Industry players have identified many module packaging challenges. Yole has analysed their insights, and is now presenting an overview of the issues.
Record attendance expected for CWIEME Berlin
This year’s CWIEME Berlin will take place across six halls at the Messe Berlin, Germany from 5th to 7th May 2015. After 19 years of continuous growth, the show is anticipating record attendance from engineers, designers, buyers and academics in the global automotive, energy, consumer electronics, industrial machinery, military and aerospace sectors with advance registration figures already going strong.
More than 4,500 professionals have registered for CES Asia
Since registration opened three weeks ago, more than 4,500 consumer technology professionals from 80 countries have registered to attend the inaugural International CES Asia. CES Asia will run from 25th to 27th May in Shanghai, China, at the Shanghai New International Expo Center and will draw global businesses to showcase the latest products and technologies entering the Asian marketplace.
Mek to exhibit 'bottom up' AOI system at IPC APEX
At this year’s IPC APEX, Mek will showcase its latest AOI and SPI systems, including the SpectorBOX ‘bottom-up’ modular AOI system specially engineered for wave and selective solder THT and SMT manufacturing.
LOPEC to host entire printed electronics value chain
The 7th iteration of LOPEC, the International Exhibition and Conference for Printed Electronics, will open its gates at the Messe München trade fair center from 3rd to 5th March, where companies and research organisations from around the world will demonstrate that printed electronic components are making their way into a number of different sectors.