Events News

At PCIM 2015, Infineon Technologies will present the latest generation of its PrimePACK power modules, which benefit from the new generation of Infineon’s IGBTs. The combination of the IGBT5 and the innovative .XT interconnection technology is an important milestone in IGBT chip and interconnection technologies.

Agile new business Thermal Issues could claim to have had the coolest stand at this year’s National Electronics Week exhibition. The company was the only supplier of tailored thermal management solutions on the show floor. Equally cool was the very warm reception given to the company’s imaginative business model.

The disruption of outdated business models in the wireless industry will pave the way for growth, predicts serial entrepreneur and keynote speaker at the CW Future of Wireless International Conference, Dr David Cleevely, CBE, FREng, FIET and chair of Cambridge Wireless.

NI (formerly AWR Corporation), says that the NI AWR Design Environment V12—the first major software release in 2015—is now available as a pre-release to select customers, partners and evaluators. Previewing for the first time at International Microwave Symposium 2015 (IMS2015) in Phoenix (May 18-22) this latest release boasts new load-pull and antenna- and radar-specific features, as well as ease-of-use improvements, speed enhancement...

Imec presents ten papers and six posters at the IEEE Interconnect Technology Conference and Advanced Metallization Conference, 18th to 21st May 2015. The results, achieved in collaboration with its industrial partners, cover different domains of imec’s industrial affiliation progammes on advanced interconnects and 3D-IC technology.

At IMS 2015, which takes place from 17th to 22nd May in Phoenix, HUBER+SUHNER will exhibit its cable assemblies designed for the space, defence and test and measurement markets.

PCIM 2015 will pay host, for the first time in Europe, to the combined power portfolio of Infineon and International Rectifier, in hall 9, booth 412, from 19th to 21st May 2015. The result of Infineon's strategic approach, outlined as “from product thinking to system understanding,” the company's range of products includes MOSFETs, IGBTs, GaN devices and speciality materials.

The German Flat Panel Display Forum, Deutsches Flachdisplay-Forum (DFF), has held this year’s first meeting of its working group System Integration on the premises of its member company i-sft in Gundersheim (Rhineland-Palatinate) on the 22nd and 23rd April.

After three intense exhibition days, the recent hall layout has proved to be successful. Despite the rail strike, around 15,000 trade visitors went to the SMT Hybrid Packaging fair in Nuremberg and benefited from the latest developments and trends in the industry. These were presented by 470 renowned national and international companies.

FSInspection will highlight its HDMag HD Inspection Station at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place 12th of May, 2015.