Events News
CWIEME to host simulation software workshop to boost efficiency R&D
CWIEME Chicago, North America’s leading annual meeting place for the electrical manufacturing industries, will host an in-depth workshop with engineering simulation software developer Ansys to help manufacturers decrease time to market and limit materials consumption when meeting impending efficiency regulations.
Synopsys to host embedded processor IP event
Synopsys will host a free one-day event focused on the latest technologies and trends in embedded processor IP, software and programming tools. In this dual-track event, experts from Synopsys, ecosystem partners and ARC processor users will describe how to overcome design challenges with hardware and software solutions optimised for low-power embedded applications. In addition, live demonstrations will showcase applications including IoT, embedde...
Two-day training course on maintaining Versaflow systems
Kurtz Ersa North America has announced that it will hold a two-day ERSA Versaflow 3 Selective Soldering Level II Application training course from 21st October, 2015 to 23rd October, 2015 at its facility in Plymouth, WI. The course will provide instructions to properly maintain the Versaflow systems with minimal or zero defects at the highest throughput possible.
Bentek to exhibit utility-scale PV products
Bentek will exhibit in Booth #3314 at Solar Power International (SPI), scheduled to take place 14th - 17th September, 2015 at the Anaheim Convention Center in Anaheim, California. Bentek will introduce several new Electrical Balance Of System (EBOS) solutions for the residential, commercial and utility-scale PV market.
Sun Chemical highlight PCB products at productronica
Sun Chemical will launch two new products to its extensive range of products for PCBs on stand 481, Hall B1 at productronica 2015, 10th to 13th November 2015 in Munich, Germany. The latest-gen Imagecure DI Soldermask and an advanced heat-resistant temporary peelable mask will be on display, along with a selection of products from its extensive offerings for PCB applications including soldermasks for rigid PCBs, etch/plating resists, legend/markin...
Keynotes revealed for the Qt World Summit
The Qt Company has started the official countdown for its first ‘Qt World Summit’ announcing the first few international speakers and keynote topics. The premier global Qt event that takes place in Berlin, Germany, 5th to 7th October 2015, will include a variety of inspiring and instructive presentations that encompass sessions focusing on various industry trends as well as in-depth technical talks. Among the confirmed presenters is K...
Socionext to exhibit at ELIV
Socionext Europe (SNEU) and Socionext Embedded Software Austria (SESA) will be showing their latest advanced automotive graphics solutions at The Congress Electronics in Vehicles (ELIV) in Baden-Baden on Booth 31. SNEU will be demonstrating what modern low cost system architecture will look like with their ‘All-in-One’ system concept, which includes a number of products from their graphics portfolio.
SoC developer forum to address next-gen embedded computing
Altera has announced the launch of the Altera SoC Developers Forum (ASDF). These inaugural events in Silicon Valley; Frankfurt, Germany; and Shenzhen, China bring together partners, developers and engineers who are focused on using the fine-grained heterogeneous computing technology in ARM-based SoC FPGAs to address next-gen embedded computing applications.
Global Tech Tour introduces a single-chip Bluetooth Smart solution
Nordic Semiconductor announces the second edition of its popular Global Tech Tour. Following the successful event held in 2012, which covered the nRF51 series SoCs, the company is introducing embedded application development engineers to its nRF52 series SoCs, powerful Bluetooth Smart/ANT/2.4GHz ULP wireless connectivity solutions that redefined single-chip Bluetooth Smart when introduced in June 2015.
DSEI 2015: High speed connector enables minimal RF noise
A rugged high speed connector has been added to its D-Sub Series by Smiths Connectors. This line of high-impedance connectors is offered with 150ohm Quadrax contacts. It has been designed to ground the outer shield Quadrax directly to the shell of the connector, providing minimal RF noise, a compelling differentiator amongst D-Sub products.