Events News

Fine workmanship down to the smallest components, the highest standards in void free solder joints, increased quality through resistance coating, or safe operation under extreme temperatures, the electronics industry continuously meets new challenges in the processing of sensitive electronic components. Rehm Thermal Systems already offers appropriate solutions and will be presenting them from 10th to 13th November 2015 at Productronica in Munich.

Saki announces presentations of its true 3D AOI and measurement equipment at the Surface Mount Technology International (SMTAI) show, being held in Rosemont, IL from 29th to 30th September 2015 at booth 1025. Saki's BF-3Di AOI System doesn't just inspect, it provides measurements of each component for heights from 0 to 20mm, with 1µm height resolution.

"Every year the SENSOR+TEST is the highlight on our event calendar,” says Matthias Bopp, CEO of the Micronas group. And he is not the only one: Exhibitors at the trade fair for sensor, measuring, and testing technology appreciate the comprehensive professionalism of the visitors from all major industries and the high quality inquiries, giving them best grades.

Industry 4.0 is on its way, in electronics production as well as in every other branch of industry. The industrial IoT is fundamentally changing the prerequisites for production and electronics manufacturing. The transformation to the networked factory means that production facilities and value chains will be linked to one another digitally in the future. That has plenty of advantages, but it also leaves companies facing some major challenges. To...

NCAB Group is pleased to announce that its Quality Manager Holly Freve presented at the SMTA Space Coast Chapter September Technical Luncheon on Wednesday 16th September 2015 at Mack Technologies in Melbourne, FL. Freve presented Cost drivers in PCB production, offering an in depth discussion about board size, layer count, copper weight, manufacturing yield, and more factors that drive costs in PCB production.

ASC International has announced that its VisionPro HSi will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from 29th - 30th September, 2015 on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

SMT Hybrid Packaging 2016, scheduled to take place from 26th to 28th April in Nuremberg, Germany, already has the same number of exhibitor registrations than the 2015 edition, seven months before the show! The numerous responses to the pre-registration deadline emphasises the significance of the event for the industry.

The ECOC exhibition will provide the stage for Anritsu to demonstrate its recently released 64Gbps test platform for engineers investigating the latest Signal Integrity, Modulations, high speed PAM4 (pulse amplitude modulation) transmission techniques intended for use in 200Gbps and 400Gbps communications links.

Kurtz Ersa North America is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place 14th October, 2015 at the Islandia Marriott Long Island in Islandia, NY. Company representatives will discuss the complete Ersa product line, including the Smartflow 2020 selective soldering system.  

BTU International has announced that it will exhibit at Heat Treat 2015, ASM’s Heat Treating Society Conference & Exhibition, scheduled to take place 21st - 22nd October, 2015, at the Cobo Convention Center in Detroit, MI, USA. BTU will highlight its controlled atmosphere furnaces in Booth 449.