Events News
Mersen solutions for energy transition
Exciting innovations to pursue energy transition will be presented at PCIM 2025 in Nuremberg by Mersen.
InP-on-Silicon design flow for next-generation optical transceivers
X-FAB Silicon Foundries SE, SMART Photonics, and Epiphany Design are collaborating to develop a new heterogeneous photonics integration platform that combines the strengths of InP and Silicon-on-Insulator (SOI) technologies, enabling multi-tera bit data rates for datacom and telecom applications.
We are exhibiting at Hardware Pioneers Max 2025, in London on April 23-24!
Electronic Specifier is heading to the UK’s largest electronics exhibition & conference, Hardware Pioneers Max 2025, in London on April 23-24! Hardware Pioneers Max is Europe’s fastest-growing electronics expo dedicated to cutting-edge technologies, solutions, and tools for innovation-driven engineering teams. The 2025 event is set to feature over 150 leading technology providers, attract more than 5,000 attende...
Samtec showcases 200+ Gbps active channels at OFC 2025
Samtec, Inc. is demonstrating next-generation, high-performance copper and optical interconnect solutions at OFC 2025 Exhibition (San Francisco, CA; April 1-3rd, 2025).
Indium Corporation showcases AI-ready materials in China
Indium Corporation will present its range of thermal interface materials (TIMs) designed for AI applications at Productronica China, taking place from 26th-28th March in Shanghai.
Belden showcases integrated network and data solutions
Belden is set to take the stage at Hannover Messe 2025, underlining its commitment to industrial innovation through strategic collaborations.
Qualcomm to deliver keynote at COMPUTEX 2025
TAITRA (Taiwan External Trade Development Council) has announced that Cristiano Amon, Qualcomm Incorporated President and CEO, is invited to be the speaker at the COMPUTEX 2025 keynote, sharing his vision of the transformative impact of AI on device experiences and ecosystems.
EMI test receivers debut at EMV 2025
The new EMI test receivers R&S EPL1001 up to 1 GHz and R&S EPL1007 up to 7.125 GHz offer engineers a flexible and cost-effective solution for EMI measurements.
Viavi readies AI infrastructure solutions for OFC 2025
Viavi Solutions will showcase its latest test solutions for AI infrastructure development, manufacturing and deployment at the 2025 Optical Fiber Communications Exhibition and Conference (OFC) in San Francisco (April 1-3).
PCIM Asia Shanghai 2025: Bringing together the Asian power electronics community
The PCIM Asia Shanghai 2025 will open its doors from 24 to 26 September 2025 at the Shanghai New International Expo Centre in Shanghai, China.
Product Spotlight
STDRIVEG611Q
STMicroelectronics
| SKU: | 497-STDRIVEG611QTR-ND |
|---|---|
| Stock: | 0 |
| Cost: | $2.63 |
TBF10SL-4PS-B
ITT Interconnect Solutions
| SKU: | 1003-TBF10SL-4PS-B-ND |
|---|---|
| Stock: | 50 |
| Cost: | $45.59 |
CAA572C0G3A663J640LJ
TDK Corporation
| SKU: | |
|---|---|
| Stock: | 1037 |
| Cost: | $9.16 |
R30-3002002
Harwin
| SKU: | 952-1510-ND |
|---|---|
| Stock: | 6545 |
| Cost: | $0.76 |
NRF54L15-QFAA-R
Nordic Semiconductor
| SKU: | 4823-NRF54L15-QFAA-RTR-ND |
|---|---|
| Stock: | 0 |
| Cost: | $2.39 |
STDRIVEG611Q
STMicroelectronics
| SKU: | 497-STDRIVEG611QTR-ND |
|---|---|
| Stock: | 0 |
| Cost: | $2.63 |
TBF10SL-4PS-B
ITT Interconnect Solutions
| SKU: | 1003-TBF10SL-4PS-B-ND |
|---|---|
| Stock: | 50 |
| Cost: | $45.59 |
CAA572C0G3A663J640LJ
TDK Corporation
| SKU: | |
|---|---|
| Stock: | 1037 |
| Cost: | $9.16 |
R30-3002002
Harwin
| SKU: | 952-1510-ND |
|---|---|
| Stock: | 6545 |
| Cost: | $0.76 |
NRF54L15-QFAA-R
Nordic Semiconductor
| SKU: | 4823-NRF54L15-QFAA-RTR-ND |
|---|---|
| Stock: | 0 |
| Cost: | $2.39 |
STDRIVEG611Q
STMicroelectronics
| SKU: | 497-STDRIVEG611QTR-ND |
|---|---|
| Stock: | 0 |
| Cost: | $2.63 |
