Events News
Electronics Fair and electronicAsia attract more than 60,000 buyers
The Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and electronicAsia, jointly organised by the HKTDC and MMI Asia Pte, concluded their physical exhibitions on the 16th October 2024.
Celebrations on the Ohmite stand
Ohmite isn’t just celebrating its 100th anniversary at electronica this year, it is showing a host of new products designed for the 21st century. The company’s 100 years of resistor technology, design, and manufacturing experience has culminated in both new products and new services.
EBV Elektronik and Infineon collaborate on ‘Power for AI’
EBV Elektronik, an Avnet company, and Infineon Technologies announce the launch of their joint communication activities on ‘Power for AI’ at this year’s electronica exhibition.
Two weeks until Advanced Engineering 2024
With just two weeks remaining until the UK’s annual engineering and manufacturing exhibition Advanced Engineering, key industry players are preparing for this year's event at the NEC, Birmingham, 30–31 October 2024.
Mouser to exhibit at MATELEC 2024 in Spain
Mouser Electronics announces that it will be an exhibitor at this year’s MATELEC international trade fair at the IFEMA MADRID in Madrid, Spain. From 5–8 November 2024, professionals from the electrical, electronics, and telecommunications sectors will come together to learn more about the latest technologies and innovations in areas, such as industrial processes, smart factories, and lighting.
STEAM 2024 event welcomed 10,000 students
On the 15th October Thorpe Park welcomed 10,000 primary and secondary students for an exclusive event organised by ACS International Schools as part of their STEAM (Science, Technology, Engineering, Arts, and Maths) 2024 programme.
Cambridge GaN Devices at ECCE
Cambridge GaN Devices (CGD) is exhibiting at the IEEE Energy Conversion Congress and Expo on Booth 319.
SCS exhibits advanced coating and conveyor systems at The ASSEMBLY Show
Specialty Coating Systems (SCS) announces its participation in The ASSEMBLY Show 2024, taking place 22–24 October 2024, at the Donald E. Stephens Convention Centre in Rosemont, Illinois.
UDDC: seamless transmission of image data to microdisplays
Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.