3D automated & solder paste inspection systems at SMT

They have interchangeable platforms, offering flexibility and providing an economical solution if applications necessitate changing from automated optical inspection to solder paste inspection or vice versa. The change can be made by a Saki technician in a matter of hours and only requires a software adjustment and some tooling. Saki's 3D optical inspection system has a unique four-way projection system and uses a special LCoS module.

The pitch of the light is not fixed, but rather is modified to provide a wider lighted area to accommodate different pitch heights, eliminating shadows and providing a brighter image and greater area from which to capture inspection data. The 3Di inspects heights up to 20mm and parts as small as 01005s, capturing reversed or inclined components with an escape of less than 1ppm.

It provides high-speed, RT measurement for a broad range of substrate coverage and inspection data that is quickly and easily generated from CAD data to greatly reduce programming and debugging time. Inspection and detection of dry joints, lifted leads, and lifted microchips is accomplished with high accuracy.

Saki's 3D solder paste inspection system measures and automatically analyses each pad. Each area is automatically measured with an active projection system that is optimised based on the warpage of the sample and the solder paste thickness.

"Saki's 3D inspection systems are built on 20 years of proven 2D imaging technology and over 10,000 fielded units," said Katsuhiro (Eddie) Ichiyama, General Manager, Saki Europe. "Saki has a complete line-up of 3D inspection solutions, SPI, AOI and X-ray. Our equipment is geared for applications where board failure is not an option. We invite all PCB manufacturers who want to ensure that their products are of the highest quality to stop by our booth at SMT Nuremberg and talk to our technical experts."