Non-metallic materials to shape emerging connector manufacturing processes

It is widely anticipated that as costs associated with these state-of-the-industry materials and processes go down, their utilisation will go up.

The ‘status quo’ of electronic components’ materials, especially those specified in interconnect designs, are facing new complications driven by advanced materials requirements. For established components, traditional nonmetallic materials (ceramics, glass, polyimides, silicon, epoxies) are readily available. However, new materials technology is required for current and future designs, including those targeting:

• Flexible, foldable, and wearable devices
• Enhanced energy efficiency, including conversion of waste heat into electricity to help power end products
• Extreme miniaturisation designs for smaller, faster, and more efficient devices

Non-metallic materials are increasingly needed in applications which meet the current and future specifications of fibre optic designs, Low Smoke/Zero Halogen (LSZH) materials. The materials moreover satisfy the environmental sustainability constraints for the development of energy-efficient and recyclable end products using ‘clean’ manufacturing processes.

Carbon fibre, the state-of-the-industry structural composite in many electronic components, costs roughly 10X that of stainless steel, the primary material used in conventional interconnects. To address the significant cost differential, varied alternative strength- and weight-effective materials are in development for employment in next-generation connector components, e.g., nanocomposites, advanced thermoplastic composites, plus graphene composites. Following is an overview of each composites’ properties:

Nanocomposites: These materials combine a polymer or matrix material with nanoscale fillers or reinforcements to significantly improve mechanical strength, durability and electrical or thermal conductivity. Fillers typically have at least one dimension in the nanometer range, e.g., nanoparticles, nanofibers, or nanotubes. The incorporation of nanoscale fillers in a matrix material can significantly optimize the mechanical properties of nanocomposites. Nanocomposites also exhibit augmented barrier properties which create a tortuous path for gas or liquid molecules to reduce permeability. This property is valuable in applications requiring gas or moisture barrier materials, such as food packaging and membranes. Important for interconnectivity, nanocomposites can exhibit improved electrical conductivity when conductive nanofillers, such as carbon nanotubes or metallic nanoparticles, are incorporated into the matrix material. They moreover benefit designs requiring electrical conductivity, such as printed electronics, sensors, and electromagnetic shielding.

Nanocomposites, a rapidly growing area of research and development, face obstacles in achieving uniform dispersion of nanofillers as well as maintaining their properties in the composite. Further research will address these issues, along with the optimisation of application-specific manufacturing processes required in varied interconnect applications. 

Advanced thermoplastic composites: Commonly specified for aerospace, marine, automotive and energy applications, advanced thermoplastic composites (ACM) combine thermoplastic polymers with reinforcing fibres or particles to achieve enhanced performance characteristics. These composites offer substantial advantages over traditional thermosetting composites, including shorter manufacturing cycles and heightened impact resistance. Unlike thermosetting composites, advanced thermoplastic composites use a matrix material (PEEK, PEI, PP and PA) that can be melted, then re-solidified multiple times without significant degradation. High strength reinforcing fibers such as carbon fibres, glass fibres, or aramid fibres, further augments the mechanical properties of the composite. Advanced thermoplastic composites can be processed utilising common techniques involving injection moulding and compression molding which allow the formation of complex shapes and structures.

Shorter manufacturing cycle times, together with cost-effective processes, make advanced thermoplastics a practical alternative. Thermoplastic matrix and reinforcing fiber selection varies according to applications’ constraints along with desired properties. Ongoing research and development focus on improving composites’ performance and recyclability.

Graphene composites: Comprised of a single layer of carbon atoms arranged in a hexagonal lattice and into a matrix, graphene composite usage notably boosts mechanical strength and stiffness while elevating mechanical properties, tensile strength, electrical and thermal conductivity. The material also supports advanced UV resistance, plus resistance to deformation. Composites are moreover an excellent conductor of electricity, making them ideal for electronic interconnects, sensors, and conductive coatings. They are further applicable in heat dissipation applications, thermal management systems and electronic packaging designs in which efficient heat transfer is critical.

Graphene composites’ wide-spread employment is expected to revolutionise the electronics industry, however these composites present challenges, primarily in layering. Graphene manufacturers continue to significantly ramp up production, focus on material consistency, and minimise production costs to meet and/or exceed electronic components’ requirements.

Forward looking: The most current research indicates world-wide demand for high-speed connectors, including those specified in automotive, defense and submarine designs, will drive electronic connector industry expansion. The data shows the global connector market, valued at $79.8 billion in 2022 is expected to grow to $168 billion by 2032; a CAGR (Compound Annual Growth Rate) of 7.9% from 2023 to 2032. It is further important to note studies show the global non-metallic/organic electronic industry was valued at $58 billion in 2022 and is projected to reach $381 billion by 2032, rising at a CAGR of 21.3% from 2023 to 2032.

An upsurge in demand for smaller (sub-microminiature) devices and application-driven configurations, which significantly benefit from new materials technology, is anticipated. Additionally noteworthy is that low-volume specialty interconnects and other electronic components will be increasingly produced by end-users employing 3D printers.