Blog
To optimise or stabilise?
Voltage optimisers and voltage stabilisers are similar in many respects and investing in this equipment can deliver a saving on your energy bill.
A deep dive into resolution from sensor standpoints
Resolution can be defined as the number of distinct elements that a sensor can capture, i.e., the sensor’s ability to distinguish between two closely spaced points. It is specified in pixels.
Apple repairability and the Right to Repair movement
In this article, Electronic Specifier’s Paige West discusses Apple repairability and how the company’s policies align with the Right to Repair movement.
The Gadget Show celebrates 20th anniversary
In a celebration of its 20th anniversary this June, The Gadget Show is back with a fresh twist.
Revitalising the Earth: harnessing technology for land regeneration
Due to the effects of over-farming and extreme weather events, such as drought, wind, or flooding, the demand for significant technological intervention becomes ever more pressing across countless nonarable and depleted areas of land worldwide.
Making sense of real-time load measurement
The handling of dry bulk materials used to be a completely manual process, but it is now being increasingly automated in a drive to reduce both the costs and the risks of injury, while also increasing throughput and accuracy.
Major imaging challenges in microscopy and how to solve them
Microscopic cameras play a major role in medical applications for surgery, pathology, and diagnostics.
Building next gen chips for your next self driving car
The concept of a self-driving car has taken the world by storm. Here Simran Khokha, Product Manager at Infineon Technologies, delves into the crucial development of next-generation chips for self driving cars, detailing their reliance on advanced semiconductors and sensors to ensure enhanced performance, safety, and comfort across various levels of vehicle automation.
IDTechEx asks if silicon anodes are the key to mass EV adoption
Maximising energy density has been one key area of focus in electric vehicle battery development.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.