Awards

KIC’s Common Recipe Finder wins award for thermal profilers

15th September 2024
KIC
Sheryl Miles
0

KIC, a pioneer in thermal process development and control, is thrilled to announce that its innovative Common Recipe Finder has been honoured with the 2024 Mexico Technology Award in the category of 'Thermal Profilers'.

The award was presented at a prestigious ceremony on 11th September 2024, before the commencement of SMTA Guadalajara, hosted by Mexico EMS, the Spanish-language publication in the electronics manufacturing industry.

The Common Recipe Finder is part of KIC’s Thermal Analysis System, which features advanced profiling software designed to enhance the efficiency and effectiveness of thermal processes in electronics manufacturing. This tool significantly reduces changeover times by identifying optimal reflow recipes that can be used across multiple PCB assemblies, thus improving both equipment utilisation and Overall Equipment Effectiveness (OEE).

Miles Moreau, General Manager at KIC, expressed his excitement about the award, stating: "We are honoured to receive this recognition from Mexico EMS. The Common Recipe Finder is a testament to KIC's commitment to innovation and our continuous effort to provide solutions that enhance productivity and operational efficiency in the electronics manufacturing sector. This tool not only simplifies the thermal profiling process but also ensures consistent quality and reduces the potential for human error."

The Common Recipe Finder utilises predictive algorithms and AI to automate the generation of common recipes, enabling manufacturers to streamline oven setups and minimise the number of unique recipes required. This innovation is particularly beneficial in reducing downtime and boosting productivity by facilitating quicker and more accurate setups.

KIC's award-winning technology is designed to address various manufacturing challenges, including process audits, automation of manual profiling, data reporting, and connectivity with MES/CFX systems. It also plays a crucial role in implementing Industry 4.0 standards, setting up new product introductions (NPI), and reducing common solder defects such as voiding, head in pillow, and tombstoning.

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