Intelligent Memory's 16Gb DDR4 x4 DRAM has been shortlisted for the Electronics Excellence Awards under the Electromechnical Product category.
High-capacity memory modules are essential for servers, data centres, and enterprise applications. However, limited space on DIMMs (dual inline memory module) restricts the number of chips that can be used.
Intelligent Memory has launched 16Gb DDR4 x4 DRAM components that allow more chips to be used per memory module due to their smaller data width per check. This results in higher memory densities, enabling the creation of memory modules with capacities of 64GB, 128GB, or even 256GB.
Applications like AI/ML, big data analytics, and HPC need massive memory bandwidth and low error rates. Standard memory configurations cannot handle such issues effectively. Intelligent Memory ensures data integrity and reduces the likelihood of undetected errors by enabling advanced error-correcting technologies such as Chipkill and Lockstep mode.
Chipkill distributes data across multiple chips so that if one chip fails, the system can reconstruct the data without interruption. This only works on modules with components in an x4 organisation.
Lockstep mode pairs DRAM modules to perform synchronised data checking, reducing the likelihood of undetected errors. This combined with its improved bandwidth and scalability, makes the IM 16Gb DDR4 x4 components ideal for applications where data integrity is vital, like in financial transactions, healthcare systems, and even Cloud computing.
For more information, visit: https://www.intelligentmemory.com/company/articles-news-events/im-launches-high-density-16gb-x4-ddr4-dram-components-and-64gb-ddr4-dram-modules
The Electronics Excellence Awards ceremony will take place at embedded world on 12th March at 4.30pm at the Hall 3 Forum.
You’re all welcome to come and see which product will win!
