ZTE Selects Tundra Semiconductor for Next Generation Platform

ZTE selected Tundra's high performance semiconductor to improve overall performance on its new Graphics Card. Tundra's high performance semiconductor has typical power consumption of 1.3W, and incorporates power management to minimize power consumption during operation. In addition, the Tundra's PCI Express product offers the flexibility, high performance, small footprint, low power consumption and drop-in compatibility that ZTE required for its new design.

Tundra's high performance PCI Express semiconductor is the best fit for ZTE's Next Generation Platform Graphics Card. Our engineers evaluated several other products available on the market and found that Tundra offered the best performance and power against the competition. Our designs require the best technology to solve our customers' needs and Tundra's interconnect solutions are the best the market has to offer, said Mr. Zhu Baowang, Project Manager, Design and Development Dept., Central Research Institute, ZTE . The design support provided by Tundra is second-to-none in the industry and ZTE continues to rely on Tundra's industry-leading interconnect expertise.

We are proud to work with ZTE on their new designs. Tundra is committed to the expanding China market and we are pleased to partner with global leaders such as ZTE to bring new technologies to the industry, said Daniel Hoste , President and Chief Executive Officer, Tundra Semiconductor. Tundra's PCI Express products offer the best performance features on the market today and are backed by Tundra's world-class design support tools, development platforms and customer support, continued Hoste.