Yield improvement tool removes barriers to real process management

By linking the MIRTEC in-line 3D AOI system with the YXLON microfocus X-ray systems starting with the FeinFocus product line and combining them with a powerful management information system, suspect parts that cannot be fully checked in-line, like BGA and QFN, are automatically inspected with industry-leading technology including inclined CT for checking the hidden joint interfaces.

All results, data and images are displayed on a single screen, including SPI data. This allows accurate decisions to be made based on complete detail. By tracking trends the technician can modify acceptance limits on the 3D AOI and SPI to improve the accuracy of the inspections.

All data is stored in one place, giving complete traceability and allowing trends to be monitored and reports produced. The result is ultimate yield improvement because the number of false fails and escapes can be reduced dramatically.

By combining the strengths of the market-leading in-line 3D AOI inspection system with the speed and accuracy of the at-line X-ray system, which allows hidden joint interfaces on bottom-terminated components like BGAs, CSPs and QFNs, to be seen, the manufacturing process is continuously and automatically improved.

The SmartLoop solution is being demonstrated for the first time in booth 7A-304 at SMT Hybrid Packaging.