VJE to Present Latest Approaches to Inspection & Rework at APP Technical Symposium

As electronics evolve to smaller, more dense and complex products with the demand for increased functionality and portability, the challenges to rework smaller, higher value electronic devices are on the rise.

Solder interconnects for smaller BGA, CSP and many popular package technologies are no longer visible using typical optical inspection. X-ray allows viewing behind the package to identify defects and monitor the soldering process.

Al Cabral has participated in advanced manufacturing, new product introduction, process and product development within the electronics industry for more than 25 years. Al has authored several technical papers and presented at many industry symposiums. He has been involved with SMTA, IPC, and NEMI. He holds a Bachelor’s degree in Mechanical Engineering from Northeastern University. His expertise includes Through-Hole assembly, Surface Mount assembly and Semiconductor packaging with special emphasis in soldering and heat transfer. Al has been a significant contributor to the development and optimization of Reflow, Rework and X-ray equipment, especially for Lead-free and microelectronic applications. Al currently serves as Global Marketing & Sales Support Manger for VJ Electronix.