VJ Electronix at NEPCON China
VJ Electronix will demonstrate the improved Micra system, XQuik II with AccuCount Technology and Summit II at NEPCON China. The Micra is designed for rework of smaller, high performance components, such as Chip Scale Packages (CSP), Package on Package (PoP) and Micro Passives (01005).
The enhanced Micra provides a larger 35 mm alignment field of view, expanding its range of applications into more automotive, medical and military/aerospace products.
The XQuik II with AccuCount Technology is helping manufacturers around the world keep accurate inventory of their component reels. The XQuik system automatically counts components as small as 01005 with better than 99 percent accuracy. The process takes only seconds, and requires no programming. The new XQuik II handles reels from 7 to 15".
The new Summit II is the latest semi-automated rework system. Improved ergonomics combined with next-generation controls and proven heating technology provide the greatest performance and flexability. Summit II features a smaller footprint, yet larger board capacity with easy to adjust board support fixtures. Enhanced SierraMate software takes the popular user-friendly operation to the next level with a simple icon driven GUI and unmatched flexibility through easily customized operation sequences.
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MAX17793
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3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
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| Cost: | $3.64 |
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IO-Link Data Link Controller with Transceiver and Integrated DC-DC
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