Ultra-thin base materials miniaturise PCBs

27th August 2019

MST

Alex Lynn

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Datasheet

Almost all markets are experiencing increasing demand for smaller and thinner electronic devices and the aerospace and automotive industries desire smaller and lighter devices for example to lower fuel costs and reduce emissions. New approaches are needed to meet the increasing demand for smaller and thinner electronic devices.

Both rigid and flexible ultra-thin base materials for PCBs can fill this need by enabling higher-density designs with enhanced miniaturisation in the Z direction, leaving more space for other components or reducing the overall thickness of the device.

Manufacturers of printed circuit boards (PCBs) that are at the heart of these electronic devices have been making them more compact and lighter primarily by decreasing the size of the copper features and board materials. Extremely thin base materials are making it possible to take miniaturisation beyond what was previously possible without compromising reliability or performance.

Considerations for ultra-thin materials

Because ultra-thin materials require specific design approaches and fabrication technology it is critical to use an experienced PCB manufacturer.

Advanced techniques such as laser direct imaging can be used with ultra-thin materials and highly precise registration processes are required because the features are typically smaller when a thinner material is used.

Since thinner materials can lead to warpage and increased flexibility, proper handling during assembly is essential. Because of these challenges, it is critical to have early discussions with the PCB manufacturer regarding handling requirements.

Assuring quality and reliability

DYCONEX has created a centre of competence for product reliability to unify all processes necessary for precise monitoring of product reliability. For aerospace applications, the laboratory has developed extensive and systematic methodologies making it possible to gather solid evidence about product reliability by employing accelerated test procedures such as the IST test.

Ultra-thin PCB base materials are suitable for all markets where miniaturisation and high reliability are vital. They can enable miniaturisation with increased functionality through higher-density designs. Working with a PCB manufacturer that offers advanced engineering services can help ensure your design is compact while remaining cost-effective and reliable.