Analysis
Tundra’s SLE Division Announces 150 Gb/s Interlaken IP Core
Silicon Logic Engineering Inc. (SLE), a high-end semiconductor design services division of Tundra Semiconductor Corporation, today announced the availability of a new 150Gb/s high speed Interlaken protocol IP core for use in ASIC designs.
SLESLE is currently shipping the new 150Gb/s core, and customers report that the IP delivers the highest data transfer rates available on the market today. “SLE continues to bring innovative, industry-first technology to market” said Jeff West , Vice President of Design Services, SLE – a division of Tundra Semiconductor. “Tundra’s customers have come to rely on the quality and reliability of SLE’s custom design services and IP core development.”
Designed and tested to be easily synthesizable into any ASIC technology, SLE’s Interlaken IP Core was built to work with off-the-shelf SERDES from most leading technology vendors. Using the vendor specific proven SERDES allows SLE customers to quickly integrate the Interlaken IP Core into the customer’s technology of choice.
“Tundra is committed to delivering outstanding design services and quality IP to customers. SLE continues to demonstrate our commitment to world-class design and development and Tier 1 customer response to this enhanced Interlaken core demonstrates strong market acceptance of this first-to-market IP offering,” said Daniel Hoste, President and Chief Executive Officer, Tundra Semiconductor.