Analysis
Tundra Semiconductor Switch Selected By GE Fanuc Intelligent Platforms
Tundra Semiconductor Corporation has announced that GE Fanuc Intelligent Platforms has selected the Tundra Tsi578, the serial RapidIO switch, for its DSP220, DSP230 and CRX800 system blades designed for defense and aerospace applications.
The “Tundra’s long history of supporting the embedded space with excellent off-the-shelf bridge and RapidIO switch solutions, coupled with their expert technical support, makes them a supplier of choice for many of our high-performance applications,” said Peter Cavill, General Manager for Military and Aerospace Products at GE Fanuc Intelligent Platforms. “Our long-term relationship with Tundra continues to support us in delivering leading-edge solutions for our customers.”
“GE Fanuc’s system blades are a perfect example of the variety of technologies that our industry-leading RapidIO Switches enable. These applications demonstrate how our customers are leveraging the value of our RapidIO interconnect solutions to bring scalability and throughput to their customers,” said Tracy Richardson, Vice President Marketing, Tundra Semiconductor.
The DSP220 is a 6U VXS (VITA 41.2) quad 8641/8641D multiprocessor. Featuring four single- or dual core Freescale™ PowerPC® 8641 system-on-chip nodes and a VITA 42.2-compliant XMC slot, the DSP220 is available in six ruggedization levels including air-, spray- and conduction-cooled for extended temperature operation as well as resistance to shock and vibration.
The DSP230 is aimed at the most demanding rugged, deployed COTS, multiprocessing applications such as radar, image and sensor processing. The DSP230 is the world’s first 0.8 inch pitch quad 8641 VITA 46 solution providing unrivalled system densities, and is available either as a standalone card or as part of an integrated AXIS MultiComputer.
The CRX800 is the world’s first rugged COTS 23-port VITA 41.2 Serial RapidIO Switch. Designed for use with VITA 41.2 (sRIO) payload boards such as the DSP220 quad 8641/8641D multi-core multiprocessor, it is available in six build levels for air-, spray- and conduction-cooled systems and is suitable for extended temperature, shock and vibration environments.