TI's VoIP and Wireless LAN Technologies power Ascom's Voice Over Wi-Fi Handsets
Texas Instruments and Ascom Wireless Solutions, a market leader in on-site wireless communication throughout Europe, have announced that Ascom's i75 voice over Wi-Fi (VoWiFi) handsets are leveraging TI's Wireless LAN (WLAN) IP phone platform, the TNETV1700. TI's integrated hardware and software solution delivers the performance and low power required for Ascom to deliver extended talk and standby times to its enterprise customers, and enhanced features such as wireless telephony, alarm and messaging.
TI's TNETV1700 WLAN IP phone platform serves at the center of Ascom's i75
handsets that support both the 802.11b and 802.11g radio networks, as well
as the 802.11i and 802.11e standards for an increased level of security and
voice quality. The VoWiFi handsets offer longer talk and standby times
based on the high performance and ultra-low power consumption that the
TNETV1700 delivers. Built-in programmability allows for easy upgrades or
expansions as standards and capabilities evolve.
The Ascom i75 handsets are part of Ascom's complete, standards-based VoWiFi
package that also includes a smart, robust messaging system, VoIP gateway
that can be integrated with current communications networks, and a Portable
Device Manager that simplifies network administration tasks. Ascom offers
two designs of its i75 handsets that are targeted at the healthcare and
heavy industry segments.
Targeted at the enterprise and residential markets, TI's WLAN IP phone
platform is a complete solution designed to help developers get to market
fast. It includes the TNETV1700 VoWLAN processor, based on TI's proven,
power-efficient OMAP(tm) architecture used worldwide today by wireless
leaders, and TI's TNETW1230 WLAN chipset with software support to meet
existing and evolving standards. TI's award winning Telogy Software(tm) for
VoIP provides the industry's leading voice processing software, and supports
the transport of toll quality voice over WLAN networks.
Other TI technology completing the solution includes the TPS65013 power
management conversion IC that provides more than 95 percent power efficiency
and steps-down power partitions during periods of call inactivity; and the
highly integrated TLV320AIC21C dual codec with interfaces to handset,
headset, speakerphone and microphone.