Analysis

TI's Network Support Package gets Substantial Updates

8th May 2006
ES Admin
0
Texas Instruments has announced it has made substantial updates to its gateway software solution, the Network Support Package (NSP) 3.7.1, enabling manufacturers to quickly and easily make improvements across product lines and realize faster time-to-market and return on investment.
The latest version of this field-proven network stack includes improved system performance and throughput, enhanced Quality of Service (QoS) and policy routing, enhanced Telogy Software for Voice over DSL applications and improved remote management, including support for DSL Forum TR-069.
Ideally suited for TI's market-leading AR7 residential gateway solutions, NSP 3.7 is also designed for quick migration to devices based on TI's next-generation UR8 architecture.

In addition to industry standard support of Telnet, Secure Shell (SSH), ClearEoC and Simple Network Management Protocol (SNMP), NSP 3.7.1 improves on remote management with the addition of DSL Forum TR-069 support. TR-069 defines a mechanism that encompasses secure auto-configuration of a CPE and also incorporates other CPE management functions into a common framework.

NSP 3.7.1 also integrates a sophisticated QoS framework, which provides much
more than ensuring available bandwidth and minimum delays for time-sensitive
applications such as video and voice. NSP 3.7.1 solves the challenges of
supporting different QoS markings from different networks by maintaining
full control over packets from the time they are received until the time
they leave the gateway. It also leverages Telogy SoftwareTM to include
support for Supplementary Services, 2-port Foreign Exchange Station (FXS)
telephony interface support and secure Real-Time Transport Protocol (RTP).
It also supports TI's PIQUA(tm) embedded IP quality management technology,
offering real-time monitoring of IP services. PIQUA technology allows
service providers to proactively assess network quality parameters and
dynamically adapt to changing conditions to enhance the subscriber
experience.

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier