The world's largest wafer bank has tripled in size at Rochester Electronics

Rochester now has two wafer/die storage facilities that provide added risk mitigation from potential disaster. Currently, the largest die bank in the world holds in excess of ten billion die in stock, 2" to 12" wafers, dating back to as early as 1968. The new expansion will now allow for upwards of 30 billion die total storage capacity. Customers have the option of available box-level rental plans as well as customized secure storage room and box-level access control. Logistics and distribution plans can be customized to any requirement including restrictions by a customer's division, department or program. Extensive die processing services are available including wafer saw, pick and place, waffle pack, gel pack, tape and reel, kitting for hybrids, mil inspections, prototyping services and LAT services.

Complementing the die services are the expanding device assembly and testing services available on-site at Rochester's USA campus. "Customers who are unsure about the special storage requirements needed at the wafer/die level can rely on the years of experience that Rochester has to make sure their end-of-life source supply is safe today and far into the future," said Loren Krott, Vice President of Manufacturing at Rochester Electronics.