Analysis
Test Interface Boards – Multitest Meets Today’s Fine-Pitch Requirements
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability. The integration is a result of the Santa Clara board fab anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs.
LeveMultitest is known for leading drilling and registration competence. The company continues to invest in high aspect ratio via capabilities to continuously enhance the fine-pitch product offering.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
