Tessera & Micron sign technology and patent license agreements
Tessera Technologies and Micron Technology have jointly announced that they have signed multiyear technology and patent license agreements. While specific terms and conditions of the agreements are confidential and have not been disclosed, the companies will also explore other possible joint development efforts.
Invensas, a wholly-owned subsidiary of Tessera, will license its Multi-Die Face-Down (xFD) semiconductor packaging technology to Micron, as well as cooperate with Micron on the manufacturing of Micron products incorporating xFD technology.
"We are delighted to reach new long-term agreements with Micron that build on our existing relationship. We are thrilled to be working closely with one of the most successful and innovative semiconductor companies on the planet," stated Tom Lacey, Chief Executive Officer, Tessera. "We have continued to develop innovative, next-generation technologies that we seek to commercialise with world-class partners like Micron. We look forward to working with Micron to commercialise high performance multi-chip xFD DRAM and other products."
Mark Durcan, Chief Executive Officer, Micron, added: "We are pleased to reach agreement with Tessera, including a patent license and a technology agreement relating to Tessera's xFD packaging technology. We look forward to discussing further joint development opportunities with Tessera."
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