TE Connectivity lines up deal to buy Silicon Microstructures

The acquisition of Silicon Microstructures will expand TE’s global position in pressure sensing technology, particularly in medical, transportation, and industrial applications.

The proposed deal will bring together SMI’s micro-electro-mechanical systems (MEMS) sensor technology design and manufacturing capabilities, with TE’s operational scale, customer base and existing sensors technologies into a more comprehensive global sensing solutions offering for customers.

“Silicon Microstructures’ MEMS pressure sensing design and manufacturing capability is utilised in various applications requiring miniature design and high-performance packaging,’ said John Mitchell, senior vice president and general manager of TE's Sensor Solutions business unit. “The MEMS low pressure sensing capability compliments TE’s pressure offering while strategically aligning to its market and application focus.”