TE Connectivity exhibit at DesignCon 2016

19th January 2016

Nat Bowers

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At the DesignCon 2016 Expo in California, 20th to 21st January, TE Connectivity will showcase a range of industry-leading data communications connectivity solutions in booth 811. TE will offer both working demonstrations and displays of the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that design engineers need for their next project.

TE’s I/O interconnects, internal interconnects, power connections, active optics and cable assemblies can be seen at the booth throughout the show. These innovative solutions help address the ever increasing demand for products that are smaller, more energy efficient and faster. TE is also presenting several demonstrations highlighting its products’ high performance capabilities and next-gen solutions in Rack-Unit (RU) based applications.

Featured solutions will include:

The advanced family of STRADA Whisper high speed backplane connectors, with an expanded range of configurations including direct plug orthogonal, mezzanine and cables all delivering at least 56Gb/s.
New Sliver internal interconnect cabled connectors that enable extended reach at 25Gb/s for on-board or embedded applications.
The micro quad small-form-factor pluggable (microQSFP) high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.

TE will be the first to develop microQSFP connectors and cages in accordance with the new specification released by the microQSFP Multi-Source Agreement (MSA) group on 15th January, 2016. TE took the lead in forming the microQSFP MSA, and expects to have standards-compliant products in the market during the first half of 2016.

microQSFP connectors provide QSFP28 connector functionality for networking equipment, but in a smaller generally SFP-sized form factor that provides 33% higher density. microQSFP allows designers to fit up to 72 ports on a standard 1RU line card, saving significant design space. In addition, microQSFP products will offer significantly better thermal performance than any other pluggable solution on the market today, requiring less energy to cool networking equipment and increasing the ease of system thermal design.

Phil Gilchrist, Vice President and CTO, Data and Devices, TE Connectivity, commented: “We are proud to showcase our cutting edge innovations like the scalable STRADA Whisper backplane solutions and to present emerging technologies like the revolutionary microQSFP pluggable interconnects. We enable design engineers to meet the demands of today’s and tomorrow’s data-driven world by engineering products that deliver the highest performance, reliability and energy efficiency.”