Swissbit at electronica: Booth A6.421

The new 2GB DDR2 Small Outline DIMM in Chip-on-Board technology has been designed especially for the use in Small Form Factor (SFF) Industrial PCs. This 200 pin SODIMM combines 1GB DDR2 dies with Winbond “buried wordline” process with Swissbit COB (chip on board) technology. Thus, the module becomes mechanically robust against shock and vibration. Due to the direct die attachment the heat dissipation is enhanced via the substrate and socket and by the extended surface. This keeps the DRAM chips at a lower die temperature under limited airflow conditions and increases the electrical performance.

The new X-200 Series SATA 2,5” SSD in Flash technology with SATA II-3GBit/s interface features an ideal memory solution for industrial portable applications. The modules also offer faster start-up and extremely short access times. Their extended temperature range and long life cycle qualify them as first choice for the use in non-volatile, high reliable applications. The X-200 series of SSD Flash storage products are offered in densities from 4GB to 64GB with data transfer rates of up to 105MB/s.
Contact persons at the booth: Marion Reithmeier, Sales and Marketing Coordinator; Tommaso Rando, Vice President Sales EMEA, Swissbit AG